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High-Tech Facility International Forum & VIP Banquet 2026
Accelerating the Future of High - Tech Facilities Through AI - Driven Innovation
Forum Time : Thursday, Sept. 3, 2026, 08:30–17:00
Forum Venue : Platinum Ballroom AB, 3F, Grand Hilai Taipei
Banquet Time : Thursday, September 3, 2026, 18:00–21:00
Banquet Venue : Platinum Ballroom BC, 3F, Grand Hilai Taipei
Organizer : Taiwan High-Tech Facility Association
Co-Organizers : NTU, Department of Civil Engineering High-Tech Facility Research Center
NTU, Center for Weather and Climate Disaster Research
This forum focuses on the forward-looking applications of AI in high-tech facility environments, exploring how it accelerates innovation across design, operations, and sustainable development. Through in-depth insights and real-world case studies shared by industry leaders, the forum will highlight groundbreaking achievements in enhancing efficiency, resilience, and environmental performance. Together, we aim to outline a development blueprint for next-generation high-tech facilities and support the industry in advancing toward a smarter, more sustainable, and globally competitive future.
Call for Posters
High-Tech Facility R&D Area, SEMICON Taiwan 2026
With the increasing complexity of semiconductor manufacturing processes and the global trend toward sustainability, Artificial Intelligence (AI) has become a key driving force for upgrading high-tech facility infrastructure. This year, the SEMICON Taiwan High-Tech Facility R&D Area sincerely invites experts from academia and research institutions to share their latest research findings and innovative applications. Topics include the use of AI technologies to optimize facility design, improve energy efficiency, enhance cybersecurity protection, and achieve carbon reduction goals.
Topics of Interest:
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Intelligent Operations: AI-Driven Facility Operations and Predictive Maintenance.
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Digital Transformation: Applications of Digital Twin and GenAI in Facility Lifecycle Management.
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Net-Zero Sustainability: AI-Assisted Energy Consumption Analysis, Water Resource Management, Carbon Footprint Tracking, Waste Reduction, and Circular Economy Technologies.
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Smart Protection: AI Applications in Cybersecurity and Occupational Safety for High-Tech Facilities.
Submission Instructions:
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Eligibility: Faculty members and students from universities and colleges nationwide, as well as researchers from research institutions.
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Abstract Format: Please submit an abstract in Chinese and/or English within 500 words, clearly indicating the research focus and AI application aspects.
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Submission Method: Please upload your manuscript to the [Link] before May 31, 2026.
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Abstract Template Link: [Click here to download]
Important Dates :
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Abstract Submission Deadline: May 31, 2026
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Notification of Review Results: June 15, 2026
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Poster File Submission: July 20, 2026
Selected Posters Benefits:
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One complimentary pass to the High-Tech Facility International Forum 2026
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For student authors, an additional complimentary pass for their advisor
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A round-trip High-Speed Rail ticket
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For student authors, a poster presentation scholarship
On-site Presentation:
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Location: SEMICON Taiwan, TaiNEX 2, High-Tech Facility Academic R&D Area Booth.
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Schedule: One day during the period of September 2 – September 4, 2026; specific time slot to be determined.
Contact Information
Sophia Liu, Email: sophialiu@htfa.org.tw
Secretariat, Taiwan High-Tech Facility Association
