High-Tech Facility International Forum 2026
Banquet Registration : https://www.htfa.org.tw/Activity_1.aspx?=Y&id=1029
High-Tech Facility International Forum 2026
Gallium Sponsor
High-Tech Facility International Forum 2025
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Forum Registration Link:
https://www.semicontaiwan.org/zh/node/17126
Thank you for your long-term support as a valued member! We are excited to offer a limited-time early bird discount for this forum. To enjoy the exclusive early bird rate for members, please complete your registration, enter your exclusive promo code, and fulfill the payment by August 5th. Seats are limited, so please secure your spot today! Registration will close once capacity is reached.
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Banquet Registration :
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Deadline: Aug 26 (or until full)
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How to Register: Please contact Peggy (peggyho@htfa.org.tw)
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Note: The online registration system is currently down. No on-site registration will be available, so please register in advance via email.
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Note: The organizer reserves the right to modify, change, interpret, or cancel this event at its sole discretion. Any updates or changes will be announced on the official website without prior notice.
Call for Posters
High-Tech Facility R&D Area, SEMICON Taiwan 2026
With the increasing complexity of semiconductor manufacturing processes and the global trend toward sustainability, Artificial Intelligence (AI) has become a key driving force for upgrading high-tech facility infrastructure. This year, the SEMICON Taiwan High-Tech Facility R&D Area sincerely invites experts from academia and research institutions to share their latest research findings and innovative applications. Topics include the use of AI technologies to optimize facility design, improve energy efficiency, enhance cybersecurity protection, and achieve carbon reduction goals.
Topics of Interest:
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Intelligent Operations: AI-Driven Facility Operations and Predictive Maintenance.
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Digital Transformation: Applications of Digital Twin and GenAI in Facility Lifecycle Management.
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Net-Zero Sustainability: AI-Assisted Energy Consumption Analysis, Water Resource Management, Carbon Footprint Tracking, Waste Reduction, and Circular Economy Technologies.
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Smart Protection: AI Applications in Cybersecurity and Occupational Safety for High-Tech Facilities.
Submission Instructions:
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Eligibility: Faculty members and students from universities and colleges nationwide, as well as researchers from research institutions.
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Abstract Format: Please submit an abstract in Chinese and/or English within 500 words, clearly indicating the research focus and AI application aspects.
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Submission Method: Please upload your manuscript to the [Link] before May 31, 2026.
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Abstract Template Link: [Click here to download]
Important Dates :
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Abstract Submission Deadline: May 31, 2026
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Notification of Review Results: June 15, 2026
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Poster File Submission: July 20, 2026
Selected Posters Benefits:
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One complimentary pass to the High-Tech Facility International Forum 2026
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For student authors, an additional complimentary pass for their advisor
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A round-trip High-Speed Rail ticket
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For student authors, a poster presentation scholarship
On-site Presentation:
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Location: SEMICON Taiwan, TaiNEX 2, High-Tech Facility Academic R&D Area Booth.
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Schedule: One day during the period of September 2 – September 4, 2026; specific time slot to be determined.
Contact Information
Sophia Liu, Email: sophialiu@htfa.org.tw
Secretariat, Taiwan High-Tech Facility Association
High-Tech Facility VIP Banquet 2026
Banquet: Platinum Ballroom B,3F, Grand Hilai Taipei
Time:18:00-21:00
High-Tech Facility International Forum & VIP Banquet 2026
Accelerating the Future of High - Tech Facilities Through AI - Driven Innovation
Forum Time : Thursday, Sept. 3, 2026, 08:30–17:00
Forum Venue : Platinum Ballroom AB, 3F, Grand Hilai Taipei
Banquet Time : Thursday, September 3, 2026, 18:00–21:00
Banquet Venue : Platinum Ballroom BC, 3F, Grand Hilai Taipei
Organizer : Taiwan High-Tech Facility Association
Co-Organizers : NTU, Department of Civil Engineering High-Tech Facility Research Center
NTU, Center for Weather and Climate Disaster Research
This forum focuses on the forward-looking applications of AI in high-tech facility environments, exploring how it accelerates innovation across design, operations, and sustainable development. Through in-depth insights and real-world case studies shared by industry leaders, the forum will highlight groundbreaking achievements in enhancing efficiency, resilience, and environmental performance. Together, we aim to outline a development blueprint for next-generation high-tech facilities and support the industry in advancing toward a smarter, more sustainable, and globally competitive future.
High-Tech Facility International Forum 2026
Silver Sponsor
Gallium Sponsor
High-Tech Facility International Forum
＊Members of the Taiwan High-Tech Facility Association, please contact the secretariat at sophialiu@htfa.org.tw to get the Exclusive Promo Code for a 19% early-bird discount on registration.
Forum Sign-Up Link :
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Call for Posters
High-Tech Facility R&D Area Poster,
High-Tech Facility International Forum,
SEMICON Taiwan 2025
Taipei Nangang Exhibition Center, Hall2, 4th Floor, Taipei, Taiwan
Booth: R7818
September 10~12, 2025
The technical committee of the High-Tech Facility International Forum invites abstracts for poster exhibition during the High-Tech Facility Academic Exhibition, SEMICON Taiwan 2025 on September 10-12, at the Nangang International Exhibition Center, Hall 2, Taipei, Taiwan.
The poster exhibition welcomes researchers from academia and experts from the industry to present their research and early-stage solutions/products to high-tech facility managers. Particularly, we encourage presentations from graduates and newcomers because we want to highlight new talents interested in our industry and provide them with insights for a successful career launch in the high-tech facility industry.
Important Dates:
● July 7 (Mon) - Paper Submission Deadline
● August 13(Wed) - Poster Review Results Notification(first draft)
● August 21(Thu) - Poster Submission Deadline(Finalize)
● September 10~12(Wed~Fri) - 10：00-17：00 High-Tech Facility R&D Area Poster
After abstract acceptance, participants are invited to submit their posters and to give their consent to make the poster available on the Forum website and High-Tech Facility R&D Area Poster.
Topic for poster:
We welcome contributions related to the theme "Accelerate Innovation, Empower Smart and Sustainable Facility." Topics include:
1. Comprehensive Upgrades of Intelligent High-Tech Facilities—from Design to Operations
2. Digitalized Decision-Making and Data-Driven Innovation
3. Environmental Sustainability and Carbon Reduction Solutions
4. Precision Management and High-Efficiency Utilization of Water and Electricity Resources
5. Waste Recycling and Sustainable Strategies
6. Green Energy Technology Applications and Innovation
7. The Critical Role of Cybersecurity in Intelligent High-Tech Facilities
8. Other technologies to enhance High-Tech Facility installations
Selected posters will receive:
1. One free admission tickets to the 2025 International Forum on High-Tech Factory Facilities.
2. If the poster presenter is a student, both the student and their advising professor will receive one free admission ticket each to the 2025 International Forum on High-Tech Factory Facilities.
3. Round-trip High-Speed Rail ticket (limited to one student).
4. Scholarship grant (limited to one student).
Poster Exhibition Co-Chairs
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Shang-Hsien Hsieh, Department of Civil Engineering, National Taiwan University
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Wei-Chih Wang, Department of Civil Engineering, National Yang Ming Chiao Tung University
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Jian-Hong Wu, Department of Civil Engineering, National Cheng Kung University
If you have any queries about the submission process, please feel free to contact the secretariat of the Taiwan High-Tech Facility Association at peggyho@htfa.org.tw
