[Preview] 2026 International Forum & VIP Banquet on HTFA

Sponsorship Invitation

Dear Members and Industry Colleagues,

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The 2026 International Forum & VIP Banquet will be held on Thursday, September 3, at the Grand Ballroom (3F), Grand Hilai Taipei. This year’s theme is "Accelerating the Future of High-Tech Facilities through AI-Driven Innovation."

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This forum focuses on the pioneering applications of AI within the high-tech facility sector, exploring how AI accelerates comprehensive transformations in design, operation, and sustainability. Through in-depth insights and practical case studies shared by industry leaders, we will showcase breakthrough achievements in enhancing efficiency, resilience, and environmental performance. Together, we aim to map out the blueprint for next-generation high-tech facilities, helping the industry move toward a smarter, more sustainable, and globally competitive future.

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The VIP Banquet will bring together senior executives, decision-makers, and key stakeholders from facility owners, alongside influential figures from industry, academia, and research institutions. It serves as an exceptional opportunity for high-level professional networking.

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We cordially invite all members and industry leaders to participate through sponsorship. For any inquiries, please contact the 2026 International Forum & VIP Banquet Sponsorship Committee:

• Manager CP Cheng (TSMC): cpcheng@tsmc.com

• Executive Secretary Dr. Dean Chang: dean@htfa.org.tw

• Ms. Peggy Ho (Secretariat): Tel: 03-668-1267 / Email: peggyho@htfa.org.tw

Official registration will open in July.